SUB-MICRON. ABSOLUTE FLAT.
Contract precision lapping for Chicago-area aerospace, semiconductor, and medical programs. Single & double-sided lapping, flat honing, mechanical-seal and wafer finishing — held to light-band flatness on production volumes.
Core Capabilities
Every lapping process below is available across Illinois, Wisconsin & Indiana, performed under documented process controls aligned with ISO 9001:2015. Submit one request and receive a direct quote covering process selection, tolerances, and lead time within one business day.
Single and Double-Sided Lapping
Free-abrasive machining on planetary kinematics. Extreme flatness and parallelism across hard, brittle, or dissimilar materials in batch volumes.
Flat Lapping
High-stock-removal flat lapping on cast-iron and composite plates. Engineered for tight dimensional control and repeatable surface finish.
Spherical/Ball Lapping
Concentric sphericity correction for valves, bearings, and optical balls. Hand-finished or fixtured depending on lot size and form requirement.
Taper, Shoulder, and Counter Bore Lapping
Internal-feature lapping for hydraulic, instrumentation, and seat geometries. Custom mandrels for repeatable taper and shoulder finishes.
Hand Lapping
Operator-finished prototype and low-volume work — tuned to part geometry, fixture access, and inspection criteria.
Machine Lapping
Machine-driven production runs on planetary, single-side, and CNC platforms for repeatable lot-to-lot finish and flatness.
Mechanical Seal/Silicon Wafer Lapping
Carbon, ceramic and silicon-carbide seal faces; silicon and SiC wafer substrates finished for downstream CMP and bonding.
Production Lapping
Long-run contract lapping with documented process cards, in-process inspection, and per-lot certification.
λ = 632.8 nm (HeNe)
Verifiable precision.
Flatness is not asserted — it is measured. Each lot is verified on temperature-stabilized metrology benches combining laser interferometry, white-light profilometry, and air gaging. Every micron is traceable to a calibrated standard.
- Laser InterferometryFlatness / Form
- White-Light Profilometry3D Surface Texture
- Stylus ProfilometerRa / Rz Roughness
- Air GagingThickness / Parallelism
Proof, not claims.
Coverage breadth, certified processes, and traceable inspection — surfaced as datasheet numbers, not marketing copy.
Tolerances achievable, by material class.
| Material Class | Typical Applications | Min Thickness | Flatness | Ra |
|---|---|---|---|---|
| Technical Ceramics (Al₂O₃, AlN) | Semiconductor chucks, seals | 0.005" | 1 light band | < 1 µin |
| Silicon Carbide (SiC) | Optics, wafer handling | 0.010" | 1/4 light band | < 0.5 µin |
| Tool Steels / Tungsten Carbide | Stamping dies, cutting tools | 0.002" | 2 light bands | < 2 µin |
| Exotic Alloys (Ti, Inconel) | Aerospace components, medical | 0.015" | 2 light bands | < 4 µin |
| Optical Materials (Sapphire, Fused Silica) | Windows, lenses, substrates | 0.004" | 1/10 light band | Sub-angstrom |
| Silicon Wafers | CMP, bonding, MEMS substrates | 0.005" | 1/4 light band | < 0.5 µin |
Chicago Lapping Co Service Areas
Precision lapping coverage spans Illinois , Wisconsin , and Indiana , with dedicated landing pages for every metropolitan area listed below.
Local-pickup and freight coverage includes Chicago , Aurora , Schaumburg , Elgin , Joliet , Rockford , Milwaukee , Madison , Green Bay , Kenosha , Racine , Appleton , Waukesha , Indianapolis , Fort Wayne , Evansville , South Bend , and Hammond . Each city page covers the lapping processes available in that metro, typical lead times, and how to submit drawings for a direct quote.
REGION: Illinois, Wisconsin & Indiana · 3 STATES · 18 METROS
Where work is performed.
Send drawings. Receive tolerances.
Quotes typically returned within one business day. Include drawings, target finish, and lot size — the response covers achievable flatness, lead time, and pricing for the part geometry.
- Direct line(618) 323-0428
- Emaildoug@chicagolappingservices.com
- HoursMon – Fri / 07:00 – 17:00 CT
- Turnaround≤ 1 business day