Precision Lapping in Indiana
Contract lapping and surface finishing for Indiana-area aerospace, semiconductor, medical, and industrial programs. Single- and double-sided lapping, flat lapping, spherical and ball lapping, mechanical-seal and silicon-wafer finishing — all held to light-band flatness on production volumes.
Send drawings. Receive tolerances.
Quotes typically returned within one business day for any Indiana-area request.
Indiana Service Area
Service is available throughout Indiana (IN). The 5 metropolitan areas below have dedicated landing pages, but coverage extends across the entire state — including communities and industrial corridors not individually listed. Quote requests from any Indiana location are welcome.
Lapping Processes Available in Indiana
Every process below is available for Indiana-area programs, performed under documented process controls. Submit one request and receive a direct quote with tolerances, lead time, and pricing within one business day.
Single and Double-Sided Lapping
Planetary single- and double-sided lapping for tight flatness and parallelism across hard, brittle, or dissimilar materials in batch volumes.
Flat Lapping
Diamond and loose-abrasive flat lapping on cast iron and composite plates — light-band flatness, controlled material removal, repeatable Ra.
Spherical/Ball Lapping
Concentric sphericity correction for valve balls, bearings, and optical spheres. Hand or fixtured depending on lot size and form spec.
Taper, Shoulder, and Counter Bore Lapping
Internal-feature lapping with custom mandrels — tapers, shoulders, and counter bores for hydraulic, instrumentation, and seat geometries.
Hand Lapping
Operator-finished prototype and low-volume work tuned to part geometry, fixture access, and inspection criteria.
Machine Lapping
Machine-driven production runs on planetary, single-side, and CNC platforms for repeatable lot-to-lot finish and flatness.
Mechanical Seal/Silicon Wafer Lapping
Carbon, ceramic and silicon-carbide seal faces; Si and SiC wafer substrates finished to sub-micron flatness for downstream CMP or bonding.
Production Lapping
Long-run contract lapping with documented process cards, in-process inspection, and per-lot certification.